Modern day electronics have become smaller and smaller, while also becoming more complicated. This puts a lot of pressure on manufacturers to fit complex components into extremely small spaces, leaving very little wiggle room for variation and stack-up problems. This makes tolerance analysis a must-have to account for inherent variation.
What's more, many modern electronics have gone from functional to fashionable, requiring great detail into gap and flush conditions that can have great impact on the Perceived Quality of the product.
LG -- Example Use Case Camera Lens -- Example Use Case Laptop Components
Not a Customer Model - Model used for demonstration purposes only
Issue: Variation in lens connections causing build and functional issues.
Solution: Simulation in 3DCS of assembly determined contributors and true cause of variation.
Results: Basic design change and simulation validation produced a reduction in overall assembly variation, greatly reducing the chance of assembly build failures.
Issue: Variation of Internal components of laptop causing assembly build issues – hard drive, mother board, ram chips, etc… - Limited space inside of Laptop case creates very little room for variation. Changes in components from manufacturing variation were causing cases where the components did not all fit inside the case, or close proximity caused thermal issues.
Solution: Simulating the assembly sequence with variation taken into account provided new insight into the source of the variation and primary trouble areas. Making minor design alterations, and rerunning the analysis validated improvements to the assembly process.
Results: With basic design changes to the placement of the components, the current amount of variation was accounted for, requiring very little adjustment in tolerances.